Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD OF TRANSFERRING ELEMENT AND METHOD OF MANUFACTURING ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2011003668
Kind Code:
A
Abstract:

To provide a method of transferring an element, capable of simplifying a transfer process.

The method of transferring the element includes: a step of sticking a first substrate (S1a) having a first peeling layer (3a) and a first element layer (17a) disposed above the first peeling layer, and a second substrate (S1b) having a second peeling layer (3b) and a second element layer (17b) disposed above the second peeling layer on each other, so that the first element layer and second element layer face each other with intermediate layers (S2, 50a, and 50b) interposed; a first peeling step of peeling the first substrate from the first peeling layer; and a second peeling step of peeling the second substrate from the second peeling layer. Thus, the two element layers can be transferred through the simple processes by sticking the two substrates on each other with the intermediate layers interposed. Further, the two substrates (element layers) can be transferred using one intermediate layer. Furthermore, simultaneous irradiation with laser light becomes possible to simplify the peeling processes.


Inventors:
Kaneda, Koji
Application Number:
JP2009000144542
Publication Date:
January 06, 2011
Filing Date:
June 17, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEIKO EPSON CORP
International Classes:
H01L21/02; H01L21/336; H01L27/08; H01L27/12; H01L29/786
Attorney, Agent or Firm:
稲葉 良幸
田中 克郎