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Title:
METHOD OF TREATING GOLD AND SILVER SLAG
Document Type and Number:
Japanese Patent JP2017133084
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To recover gold and silver of high quality from wastes from circuit boards including silicon substrates containing gold, particularly Si in large quantities.SOLUTION: A method of treating gold and silver slag includes leaching of gold and silver slag, which contains Si by 50 mass% or more, with aqua regia, and reducing of post-leaching liquid, obtained by the leaching, with sodium sulfite.SELECTED DRAWING: None

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Inventors:
AOKI KATSUSHI
Application Number:
JP2016015924A
Publication Date:
August 03, 2017
Filing Date:
January 29, 2016
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C22B11/00; B09B3/00; C22B3/06; C22B3/44; C22B7/00
Attorney, Agent or Firm:
Axis International Patent Business Corporation



 
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