Title:
METHOD OF WASHING SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP2004349460
Kind Code:
A
Abstract:
To provide a method of washing semiconductor wafer which can suppress the corrosion of semiconductor wafer surface without necessity of a special apparatus.
The method of washing semiconductor wafer utilizes water and a washing liquid including low volatile solvent having the boiling point higher than that of water. In this washing method, it is preferable to use the washing liquid by spraying it on the semiconductor wafer.
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Inventors:
IMAIZUMI TETSUNORI
CHIBAHARA HIROYUKI
YOSHIDA YASUHIRO
FUKADA TETSUO
CHIBAHARA HIROYUKI
YOSHIDA YASUHIRO
FUKADA TETSUO
Application Number:
JP2003144634A
Publication Date:
December 09, 2004
Filing Date:
May 22, 2003
Export Citation:
Assignee:
RENESAS TECH CORP
International Classes:
H01L21/304; (IPC1-7): H01L21/304
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
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