Title:
ウェハ状の基板を処理する方法、装置、および該装置の使用
Document Type and Number:
Japanese Patent JP6650073
Kind Code:
B2
Abstract:
The present invention refers to a method for processing a wafer like substrate using a touching gripper and a touchless gripper. Furthermore, the present invention refers to an apparatus for processing a wafer-like substrate containing a touching gripper and a touchless gripper. Additionally, the present invention refers to the use of an inventive apparatus to process a wafer-like substrate.
Inventors:
Ralph Lauen Bush
Tobias Bussenius
Daniel Buchbearer
Ray Weinholt
Tobias Bussenius
Daniel Buchbearer
Ray Weinholt
Application Number:
JP2019514773A
Publication Date:
February 19, 2020
Filing Date:
September 14, 2017
Export Citation:
Assignee:
Atotech Deutschland GmbH
International Classes:
C25D17/06; C25D17/08; C25F7/00; H01L21/304; H01L21/306; H01L21/677
Domestic Patent References:
| JP2013204057A | ||||
| JP2011258682A | ||||
| JP2004011005A |
Foreign References:
| US20110263133 | ||||
| US20130216348 | ||||
| US5359785 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima