構成要素を形成する方法、プレート及びフレーム熱交換器を形成する方法および熱交換プレート

Japanese Patent JP7319904

B2

A method of forming a component includes depositing a ceramic material within an open-cell void (206) of a polymer body (200). The ceramic material deposited around the periphery of the open-cell void structure forms a thermally-conductive path (210) through the polymer body. The ceramic material circumscribes an open volume extending the entire length of the thermally-conductive path that is filled with a sealant such that fluids are incommunicable from the first surface (202) to the second surface (204) via the thermally-conductive path. A method of forming a heat exchanger includes forming a plurality of plates, each plate formed as a thermally-conductive polymer body. The method of forming the heat exchanger further includes arranging the plurality of plates within a housing to form a plate and frame heat exchanger configured to place a first flowpath in a heat exchange relationship with a second flowpath.

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Haralambos Cordatos
George Oss S. Zaphyris

JP2019225445A

August 02, 2023

December 13, 2019

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HAMILTON SUNDSTRAND CORPORATION

C23C16/34; B32B5/18; B32B7/027; B32B15/08; B32B27/18; B32B38/08; C23C16/38; F28F3/08; F28F19/00; F28F19/06; F28F21/04; F28F21/06

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JP2017047563A
JP2016004937A
JP2008051390A
JP2016108398A
JP2013505368A

US20180005917

Hiromichi Kobayashi
Kiyoshi Tomioka

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