Title:
MICRO CAPSULE FOR CURING EPOXY RESIN AND EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2016153475
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a micro capsule for curing an epoxy resin exhibiting excellent storage stability and quick curing property, hardly generating void in a cured article and hardly corroding an electrode connecting the cured article or the like even when exposed to high temperature and high humidity when blended with an epoxy resin composition, and an epoxy resin composition containing the micro capsule for curing an epoxy resin.SOLUTION: There is provided a micro capsule for curing an epoxy resin having a core agent and a shell layer arranged on a surface of the core agent, where the core agent is a curing agent and/or curing accelerator having solubility to water of 5 wt.% or more, the shell layer contains a polymer having solubility to water of 5 wt.% or less and solubility to methanol of 10 wt.% or more.SELECTED DRAWING: None
Inventors:
IWAMOTO MASASHI
YAMAGAMI MAI
YAMAUCHI HIROSHI
YAMAGAMI MAI
YAMAUCHI HIROSHI
Application Number:
JP2015221401A
Publication Date:
August 25, 2016
Filing Date:
November 11, 2015
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08G59/40
Attorney, Agent or Firm:
Atomi International Patent Office
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