Title:
MICROENCAPSULATED WOOD ANTIFUNGAL COMPOSITION, AND METHOD FOR PREVENTING GENERATION OF FUNGUS IN WOOD
Document Type and Number:
Japanese Patent JP2004300126
Kind Code:
A
Abstract:
To provide a microencapsulated wood antifungal composition which prevents pollution due to fungi in woods, is low in environmental load by reducing irritation and toxicity, and gives an antifungal effect sustainably to the wood, and also to provide a method for preventing fungal generation in the wood.
This microencapsulated wood antifungal composition contains a microencapsulated dithiol compound represented by formula (I) (wherein R1 and R2 are each H, phenyl or halogen, but they may be the same or different). The fungal generation in the wood can be prevented by using the composition.
Inventors:
WATANABE YASUTOSHI
KAYANO KOHEI
SATO TOSHIO
KAYANO KOHEI
SATO TOSHIO
Application Number:
JP2003127544A
Publication Date:
October 28, 2004
Filing Date:
March 28, 2003
Export Citation:
Assignee:
API CORP
International Classes:
B27K3/34; A01N25/28; A01N43/26; (IPC1-7): A01N43/26; A01N25/28; B27K3/34
Attorney, Agent or Firm:
Takamiya Castle Masaru
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