To provide a microphone package which is provided with a leak hole with stable dimensional accuracy, and thereby provides acoustic characteristics excellently at a low cost.
The microphone package includes: a circuit board 2; a microphone chip 3 mounted on the circuit board 2; and a case 7 enclosing the microphone chip 3 in a way of forming a space around the upper part of the microphone chip 3 and sealed to and mounted on the circuit board 2. The case 7 comprises two large and small cases 5, 6 of nearly the same shape, fitted to each other and used twofold, the cases 5, 6 respectively have through-holes 8, 9, and a groove 10 is formed to the joining face of the two cases 5, 6 so as to form a vent hole by communicatively connecting the two through-holes 8, 9 in a state in which the two cases 5, 6 are fitted to each other.
KAWADA HIROSHI
YOSHIDA TAKESHI
USHIYAMA NAOKI
Katsumi Taguchi
Shinichi Mizuta
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