Title:
MICROWAVE INTEGRATED CIRCUIT AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP2768873
Kind Code:
B2
Abstract:
PURPOSE: To provide an extremely small microwave IC with very small size, high performance, high reliability at a low cost.
CONSTITUTION: A material of an insulation substrate 2 is formed directly thin on a carrier 1 and a thin substrate 2 is used for an insulation layer of an MIM capacitor 5. Then ions are injected selectively to part of the substrate to change its dielectric constant to obtain an optional capacitance or an area of a capacitor. Moreover, an upper electrode 5a of the capacitor is provided. Thus, the parasitic impedance is reduced, high performance is attained, number of components and number of process are reduced.
Inventors:
Yuji Yanagi
Application Number:
JP23266592A
Publication Date:
June 25, 1998
Filing Date:
August 10, 1992
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L25/00; H01L49/02; H01P1/00; H01P3/08; H01P11/00; (IPC1-7): H01P11/00; H01L25/00; H01L49/02; H01P1/00; H01P3/08
Domestic Patent References:
| JP63200602A | ||||
| JP4132920A | ||||
| JP260205A | ||||
| JP1164052A | ||||
| JP5893332A | ||||
| JP3210803A |
Attorney, Agent or Firm:
Hiroaki Tazawa (2 outside)
Previous Patent: METHOD FOR READING IMAGE AND DEVICE THEREFOR
Next Patent: LOOP FORMING DEVICE FOR TAPE-LIKE CLOTH
Next Patent: LOOP FORMING DEVICE FOR TAPE-LIKE CLOTH