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Title:
MILLIMETER-WAVE MODULE FASTENING STRUCTURE
Document Type and Number:
Japanese Patent JP2012205243
Kind Code:
A
Abstract:

To provide a millimeter-wave module fastening structure that prevents stress due to thermal expansion and stress concentration.

A pin part 20a of a block member 20 is inserted into a diameter 18a of a flange part 18 sufficiently securing a gap shown in a millimeter-wave module fastening structure M, and inserted into and fixed in a pin hole 2c provided to a fixation place 2. An irregular member 30 is put over the block member 20, and two screw members 40 are inserted into a diameter 30a of the irregular member 30 and a diameter 20c of the block member 20, and inserted into and fixed in a screw hole 2d of the fixation place 2. The screw members 40 is inserted into a diameter 18b of the flange part 18 of a module assy part 10, and inserted into and fixed in a screw hole 2b provided to the fixation place 2. In a structure like this, a millimeter-wave module 10 is fixed to a case part 1 by fastening a waveguide part 11 of the millimeter-wave module 10 and a waveguide part 3 of the case part 1 using the block member 20 and irregular member 30.


Inventors:
Sawada, Hisashi
Application Number:
JP2011000070362
Publication Date:
October 22, 2012
Filing Date:
March 28, 2011
Export Citation:
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Assignee:
HITACHI KOKUSAI ELECTRIC INC
International Classes:
H01P1/04; H01P1/30
Attorney, Agent or Firm:
堀 城之
前島 幸彦