Title:
造形装置、造形方法および造形システム
Document Type and Number:
Japanese Patent JP7075778
Kind Code:
B2
Abstract:
To stably perform molding with improved adhesiveness between molding material layers.SOLUTION: A heating module 20 in a three-dimensional molding apparatus 1 heats a molding material layer Ln-1 formed of a filament. A discharge module 10 in the three-dimensional molding apparatus 1 discharges a molten filament to the heated molding material layer Ln-1 to layer a subsequent molding material layer Ln. A control portion 100 in the three-dimensional molding apparatus 1 includes a temperature information output portion 160 that outputs temperature information about the temperature of the molding material layer Ln-1 formed of the filament.SELECTED DRAWING: Figure 13
Inventors:
Yoshinobu Takeyama
Yoichi Ito
Atsushi Takai
Takeshi Arao
Tomomi Akieda
Yoichi Ito
Atsushi Takai
Takeshi Arao
Tomomi Akieda
Application Number:
JP2018029775A
Publication Date:
May 26, 2022
Filing Date:
February 22, 2018
Export Citation:
Assignee:
S. Lab Co., Ltd.
International Classes:
B29C64/386; B29C64/118; B29C64/268; B29C64/295; B33Y10/00; B33Y30/00; B33Y40/10; B33Y50/02
Domestic Patent References:
| JP2017523063A | ||||
| JP2017077671A |
Foreign References:
| WO2017196344A1 | ||||
| US20180017957 | ||||
| US20170072633 |
Attorney, Agent or Firm:
Patent Corporation MIP
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