To provide an epoxy resin useful as an electric/electronic insulation material forming cured products having excellent heat resistance, laminates (such as a print circuit board) and several kinds of composite materials such as CFRP, and as adhesives, coatings, resist materials and the like, which resin has low viscosity and a low melting point and is excellent in workability, to provide an epoxy resin composition containing the resin, and to provide a cured product of the composition.
The modified epoxy resin comprises an epoxy resin obtained by glycidylating a mixture of a compound (a) of phenols represented by general formula (1) (wherein R is each independently H, a halogen atom, a 1-10C hydrocarbon, trifluoromethyl or an aryl; and n is a mean value of measured values at UV 254 μm by gel permeation chromatography and is 0-10) with 4,4'-dihydroxybiphenyl (b).
AKATSUKA YASUMASA
OSHIMI KATSUHIKO
TANAKA RYUTARO
| JP2002226552A | 2002-08-14 | |||
| JP2004010877A | 2004-01-15 | |||
| JPH11140162A | 1999-05-25 | |||
| JP2002187933A | 2002-07-05 | |||
| JPH1143531A | 1999-02-16 |