Title:
多価ヒドロキシ樹脂、その製造方法、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
Document Type and Number:
Japanese Patent JP6937744
Kind Code:
B2
Abstract:
Provided are: an epoxy resin composition which is capable of providing a cured product that exhibits high Tg properties and excellent thermal decomposition stability if used for lamination, molding, casting, bonding and the like, while having an excellent effect of reducing chlorine ions in an extraction solution, and which is useful as a sealing material for electrical/electronic components and the like, a circuit board material and a sheet material; and a polyhydroxy resin which serves as a starting material for an epoxy resin that is used for the purpose of obtaining the above-described cured product. A polyhydroxy resin represented by general formula (3), which is characterized in that: a component where n = 0 is from 15% to 30% (inclusive); a high molecular weight component where n = 6 or higher is 30% or less; and the total chlorine amount is 1,000 wt ppm or less. (In the formula, n represents a number of 0-20.)
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Inventors:
Ken Hirota
Masami Omura
Masami Omura
Application Number:
JP2018509344A
Publication Date:
September 22, 2021
Filing Date:
March 29, 2017
Export Citation:
Assignee:
Nippon Steel Chemical & Material Co., Ltd.
International Classes:
C08G61/02; C08G59/06
Domestic Patent References:
| JP2006248912A | ||||
| JP2015189925A | ||||
| JP2013209503A | ||||
| JP6271654A |
Foreign References:
| WO2014065152A1 | ||||
| WO2011074517A1 | ||||
| WO2015146606A1 | ||||
| WO2014103926A1 | ||||
| WO2012043563A1 | ||||
| WO2009110052A1 |
Attorney, Agent or Firm:
Kazuya Sasaki
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Katsuo Naruse
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Katsuo Naruse