MOISTURE-/LIGHT-CURABLE COMPOSITION, AND ELECTRONIC CIRCUIT DEVICE INCLUDING CURED FILM FORMED FROM THE COMPOSITION

Japanese Patent JP2014201593

A

PROBLEM TO BE SOLVED: To provide a moisture-/light-curable composition which has excellent handleability, which has good curability, not only in an area irradiated with ultraviolet light but also in an area irradiated insufficiently with the ultraviolet light, which provides a cured product thereof having excellent electrical insulating properties, and to provide an electronic circuit device including a cured film formed from the moisture-/light-curable composition, and a production method and a storage method of the moisture-/light-curable composition.SOLUTION: The moisture-/light-curable composition for coating an electronic circuit contains: a (meth)acrylate oligomer (A) having average 1.5 or more (meth)acryloyl groups in one molecule thereof and a diene-based or hydrogenated diene-based skeleton; a compound (B) the homopolymer of which has a glass transition temperature of 50°C or lower and which has one (meth)acryloyl group and no isocyanate-reactive group; a compound (C) having two or more isocyanate groups; and a photopolymerization initiator (D) having no isocyanate-reactive group. The components (A) to (D) are contained in a specific ratio.

OKITA HIKARI
KATO HISAO
OKAZAKI EIICHI

JP2013075606A

October 27, 2014

April 01, 2013

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TOAGOSEI CO LTD
DENSO CORP

C08G18/30; C08F290/04; C09D4/02; C09D5/25; C09D7/12; C09D175/16

JP2012001671A	2012-01-05
JPH0733837A	1995-02-03
JP2012121935A	2012-06-28
JP2011032405A	2011-02-17

EP2527383A1

2012-11-28

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