実装回路板用防湿絶縁塗料および電子部品

Title:

実装回路板用防湿絶縁塗料および電子部品

Document Type and Number:

Japanese Patent JP5623094

Kind Code:

B2

Abstract:

To provide a moisture-proof insulation coating for a packaging circuit board having excellent close-adhesion property to a glass substrate and capable of being cleanly peeled off without being deposited onto the glass substrate at peeling off.

The moisture-proof insulation coating for the packaging circuit board contains (A) a styrene-butadiene block copolymer having an alkoxysilyl group in the molecule and (B) an organic solvent as indispensable components, and the alkoxysilyl group contained in the component (A) is preferably represented by formula (1) (wherein R1represents a 1-5C alkoxy group, R2represents a 1-20C alkyl group, an aryl group or an aralkyl group, a represents an integer of 1-3, b represents an integer of 0-2, and a+b=3).

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Inventors:

大賀一彦
東律子

Application Number:

JP2010027882A

Publication Date:

November 12, 2014

Filing Date:

February 10, 2010

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Assignee:

昭和電工株式会社

International Classes:

C09D153/02; C09D5/25; C09D7/12; C09D7/47; C09D109/06; C09D125/10; H05K3/28

Attorney, Agent or Firm:

Aoki 篤
Ishida 敬
Tetsuji Koga
Tomoyasu Nagasaka
Yoshihiro Kobayashi
Atsushi Ebiya

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