Title:
MOISTURE-REACTIVE ADHESIVE COMPOSITION HAVING VERY LOW TEMPERATURE DEPENDENCY OF SHEAR MODULUS
Document Type and Number:
Japanese Patent JP2009114428
Kind Code:
A
Abstract:
To provide adhesives with minimized temperature dependency of shear modulus.
A moisture-reactive adhesive composites which comprise a specific dialdimine and a polyurethane polymer P1 which is liquid at room temperature and contains isocyanate groups. These compositions are notable for a very low temperature dependency of shear modulus, i.e. after 7 days' storage at room temperature and 50% relative humidity, they feature a ratio of the shear modulus measured at -20C to the shear modulus measured at 23C of less than 1.7. These adhesive compositions are suitable particularly as glazing adhesives for means of transport.
Inventors:
KONSTANZER MARTIN
BURCKHARDT URS
BURCKHARDT URS
Application Number:
JP2008232640A
Publication Date:
May 28, 2009
Filing Date:
September 10, 2008
Export Citation:
Assignee:
SIKA TECHNOLOGY AG
International Classes:
C09J175/04; C08G18/10; C08G18/70; C09J175/06; C09J175/08
Domestic Patent References:
| JP2007509200A | 2007-04-12 | |||
| JPH08302960A | 1996-11-19 | |||
| JP2007509200A | 2007-04-12 | |||
| JPH08302960A | 1996-11-19 |
Foreign References:
| US4469831A | 1984-09-04 | |||
| US4469831A | 1984-09-04 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
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