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Patent Searching and Data


Title:
MOLD APPARATUS
Document Type and Number:
Japanese Patent JPH06335937
Kind Code:
A
Abstract:

PURPOSE: To provide a mold apparatus by which burrs on the peripheral part of a pot of a mold for molding a thermosetting resin can be reduced.

CONSTITUTION: The apparatus consists of a pot 1 into which a thermosetting resin is poured, a plunger 2 for pushing out the thermosetting resin poured into the pot 1, a pot holder 3a and a sub pot holder 3b holding the pot 1, a cull block 4 which is a part of a mold for molding the thermosetting resin, and an elastic means imparting the elasticity to the pot 1. In addition, the elastic means is constituted of an elastic pin 5 and an elastic pin holder 6 and a structure wherein the pot end face 1c of the pot is projected more than the pot holder end face 3c of the pot holder 3a is provided by the elastic means.


Inventors:
SUZUKI JUNICHI
Application Number:
JP12733193A
Publication Date:
December 06, 1994
Filing Date:
May 28, 1993
Export Citation:
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Assignee:
HITACHI LTD
HITACHI TOKYO ELECTRONICS
International Classes:
B29C45/02; B29C45/26; H01L21/56; B29K101/10; B29L31/34; (IPC1-7): B29C45/02; B29C45/26; H01L21/56
Attorney, Agent or Firm:
Yamato Tsutsui