Title:
金型清掃用樹脂組成物
Document Type and Number:
Japanese Patent JP7265495
Kind Code:
B2
Abstract:
Provided is a resin composition for die cleaning including a melamine resin, a filler, an acidic compound, and at least one compound selected from the group consisting of an imide compound having a molecular weight of 500 or less and a urea compound having a molecular weight of 500 or less. The acidic compound is a different compound from the imide compound, and the ratio of the total mass content of the imide compound and the urea compound to the mass content of the acidic compound is in the range of 0.01-100.0.
Inventors:
Yoshimura Katsunori
Iwata Atsushi
Yoichi Fukunishi
Iwata Atsushi
Yoichi Fukunishi
Application Number:
JP2020006344A
Publication Date:
April 26, 2023
Filing Date:
January 17, 2020
Export Citation:
Assignee:
Nippon Carbide Industry Co., Ltd.
International Classes:
B29C33/72
Domestic Patent References:
| JP2018119150A | ||||
| JP220538A | ||||
| JP1139649A |
Foreign References:
| WO2013011876A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office
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