To provide a mold for galvanoplasty and a method for fabricating a mold for galvanoplasty, concerning the field of micromechanical parts, particularly micromechanical parts for timepiece movements.
There is discloded a method (3) of fabricating a mold (39, 39') including the following steps: (a) depositing (9) an electrically conductive layer on the top (20) and bottom (22) of a wafer (21) made of silicon-based material; (b) securing (13) the wafer to a substrate (23) using an adhesive layer; (c) removing (15) one part (26) of the conductive layer from the top of the wafer (21); and (d) etching (17) the wafer as far as the bottom conductive layer (22) thereof in the shape (26) of the part removed from the top conducive layer (22) to form at least one cavity (25) in the mold.
GOLFIER CLARE
THIEBAUD JEAN-PHILIPPE
| JP2010216014A | 2010-09-30 | |||
| JPH11100689A | 1999-04-13 | |||
| JP2005256110A | 2005-09-22 | |||
| JP2006169620A | 2006-06-29 | |||
| JP2005256110A | 2005-09-22 | |||
| JP2006169620A | 2006-06-29 | |||
| JP2010216014A | 2010-09-30 | |||
| JPH11100689A | 1999-04-13 |
Shigeki Yamakawa
Next Patent: MOLD FOR GALVANOPLASTY AND METHOD OF FABRICATING THE MOLD FOR GALVANOPLASTY