Title:
MOLD FOR METALLIC FOIL PRESSURE BONDING
Document Type and Number:
Japanese Patent JP3515518
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a mold for metallic foil pressure bonding which can bond a metallic foil with a uniform adhesion strength to inside surfaces of hallows or through holes formed on a resin molded article.
SOLUTION: The mold for metallic foil pressure bonding is applied to pressure bonding of the metallic foil to the resin molded article. The mold for metallic foil pressure bonding 20 has a pin 23 having a round section formed as a regular pyramid shape at a tip end of a round rod 21 in order to assure pressure bonding of the metallic foil to also the holes of the resin molded article.
Inventors:
Yonebayashi, Minoru
Application Number:
JP2000385767A
Publication Date:
April 05, 2004
Filing Date:
December 19, 2000
Export Citation:
Assignee:
KOJIMA PRESS CO LTD
International Classes:
B29C65/02; B29C65/56; H05K3/00; H05K3/40; B29L7/00; B29L9/00; (IPC1-7): B29C65/56; H05K3/00; H05K3/40
Attorney, Agent or Firm:
石田 敬 （外３名）