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Title:
MOLD AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2011098571
Kind Code:
A
Abstract:

To realize a mold showing superior heat resistance and abrasion resistance.

The mold includes a mold body and a diamond-like thin film covering the mold body and containing silicon. The heat-resistant diamond-like thin film is formed on a surface of a base material, and contains silicon wherein the concentration of the silicon in the boundary to the base material is higher than the concentration of the silicon in the surface, and the change of the concentration of the silicon between the boundary to the base material and the surface is continuous.


Inventors:
NAKATANI TATSUYUKI
OKAMOTO KEIJI
OGAWA JUNJI
ANDO SATORU
AKIYOSHI TSUTOMU
WASHIMI TOMOHIRO
Application Number:
JP2011016547A
Publication Date:
May 19, 2011
Filing Date:
January 28, 2011
Export Citation:
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Assignee:
TOYO ADVANCED TECH CO
International Classes:
B29C33/38; B21D37/01; B21D37/20; B21J13/02; C23C16/27
Domestic Patent References:
JP2000123348A2000-04-28
JP2002544380A2002-12-24
JP2000144426A2000-05-26
JP2002086454A2002-03-26
JPH10226874A1998-08-25
JP2000123348A2000-04-28
JP2002544380A2002-12-24
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Kazunari Ninomiya
Tomoo Harada
Iseki Katsumori
Seki Kei
Yasuya Sugiura
Daisuke Kawabe
Masanori Hasegawa
Tsuguya Iwashita
Koji Fukumoto
Ryo Maeda
Mawaki Hachizo
Yukichi Matsunaga
Kenji Kawakita
Shohei Okazawa



 
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