Title:
MOLD RELEASE AGENT AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3723810
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a mold release agent capable of stably dispersing a wax in a solvent without heating the wax.
SOLUTION: Almost all of a solid wax is ground into wax particles with a particle size of 5 μm or below by stirring the solid wax and the solvent in a wet grinding and dispersing machine to obtain a dispersion wherein the wax particles are dispersed in the solvent. Accordingly, the wax can be dispersed in the solvent without being heated and melted by a conventional method, the labor for temperature control can be eliminated and the compounded mold release agent difficult to manufacture heretofore can be manufactured by dispersing a low boiling point solvent and a high melting point wax in a low boiling point solvent.
More Like This:
| WO/2019/234947 | MOLD RELEASE AGENT COMPOSITION AND DIE CASTING METHOD |
| JPS58184039 | PIPE OF GATING SYSTEM MADE OF METAL |
Inventors:
Suenobu Sugita
Application Number:
JP2003354780A
Publication Date:
December 07, 2005
Filing Date:
October 15, 2003
Export Citation:
Assignee:
Limited company S Accord
International Classes:
B22C3/00; B29C33/62; C09K3/00; C10M109/00; C10M173/00; C10M177/00; C10N20/06; C10N40/36; C10N70/00; (IPC1-7): B29C33/62; B22C3/00; C10M109/00; C10M173/00; C10M177/00
Domestic Patent References:
| JP2003528948A | ||||
| JP2032816A | ||||
| JP2000198121A |
Attorney, Agent or Firm:
Kitao Matsuura