Title:
MOLD RELEASE LAYER FORMING COMPOSITION AND MANUFACTURING METHOD OF MOLD RELEASE FILM
Document Type and Number:
Japanese Patent JP2022106533
Kind Code:
A
Abstract:
To provide a mold release layer formation composition capable of manufacturing a mold release film excellent in mold releasability and solvent resistance and a manufacturing method of the mold release film.SOLUTION: Provided are a composition for forming a release layer containing a melamine compound (A), a xylene polyol (B), an acid catalyst (C), and a hydroxyl group-containing modified silicone resin (D), and a manufacturing method of a mold release film characterized by coating the composition for forming the release layer on at least one surface of a resin film and heating thereafter.SELECTED DRAWING: None
Inventors:
NISHIMURA NAOYA
GOKAN HIROHIKO
OKAMOTO YUKIO
GOKAN HIROHIKO
OKAMOTO YUKIO
Application Number:
JP2021001607A
Publication Date:
July 20, 2022
Filing Date:
January 07, 2021
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
C08G14/14; C08G16/06; C08L61/34; C08L83/06; C09D7/63; C09D161/28; C09D183/04