Title:
MOLD
Document Type and Number:
Japanese Patent JP2016131996
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a mold having excellent adhesion in die matching of an upper die and a lower die.SOLUTION: An upper die 11 has an upper form 12, and an upper sand mold 13 molded in the upper form 12 with molding sand obtained by kneading sand and a resin. A lower die 21 has a lower form 22, and a lower sand mold 23 molded in the lower form 22 with the molding sand obtained by kneading sand and the resin. A mating face of the upper sand mold 13 and the lower sand mold 23 is projected furthermore than the upper form 12 and the lower form 22.SELECTED DRAWING: Figure 3
Inventors:
FUJIMOTO MASAKI
SASAKI KENJI
YOSHINO MASAHIRO
MATSUDA KENJI
SASAKI KENJI
YOSHINO MASAHIRO
MATSUDA KENJI
Application Number:
JP2015007961A
Publication Date:
July 25, 2016
Filing Date:
January 19, 2015
Export Citation:
Assignee:
YOSHIWA KOGYO CO LTD
International Classes:
B22C9/02; B22C9/08; B22C9/12
Domestic Patent References:
| JPS4713743B1 | ||||
| JPS4727612Y1 | 1972-08-22 | |||
| JPS5835041A | 1983-03-01 | |||
| JPS431733B1 | ||||
| JPS342105B1 | ||||
| JP2006334612A | 2006-12-14 | |||
| JPH06218492A | 1994-08-09 |
Attorney, Agent or Firm:
Maeda patent office