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Title:
MOLDED BASE PLATE
Document Type and Number:
Japanese Patent JP2016016670
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a molded base plate discharging remaining gas in a resin molding space, and releasing bubbles in a resin molding material during resin molding.SOLUTION: A position where resin is molded on a molded base plate 12 is shown by 121. A projection 315 is formed on the base plate 12. At the beginning of resin molding, a constant gap is kept between the base plate 12 and a resin molding plate 31, but after injecting molten resin into a molding cavity 311, a projection shape is collapsed by applying a pressure of or higher than a certain level so as to completely join the base plate 12 and the resin molding plate 31.SELECTED DRAWING: Figure 16

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Inventors:
YAMAOKA YASUTAKA
OSHIMA HIROYUKI
OKAMOTO HIROTAKA
Application Number:
JP2014238891A
Publication Date:
February 01, 2016
Filing Date:
November 26, 2014
Export Citation:
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Assignee:
YAMAOKA SEISAKUSHO KK
International Classes:
B29C43/36; B29C43/10
Domestic Patent References:
JP2003174124A2003-06-20
JPS6164413A1986-04-02
JPH09226008A1997-09-02
JPH10235682A1998-09-08
JP2000246742A2000-09-12
JPH09181104A1997-07-11
JP2012121237A2012-06-28
JPH11121656A1999-04-30
Attorney, Agent or Firm:
Hidekazu Miyoshi
Koji Kato



 
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