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Title:
MOLDED BODY COMPOSED OF CONDUCTIVE CERAMICS AND MANUFACTURE OF CONTACT FACE OF SUCH KIND OF MOLDED BODY
Document Type and Number:
Japanese Patent JP3149021
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To facilitate a certain attachment having small contact resistance of an electrode by infiltirating a conductive metal in a contact area for attaching of an electrode composed of a molded body consisting of a conductive ceramics.
SOLUTION: A core body 2 is formed in a honeycombed shape and has many longitudinally extending fluid pathes 4, which are separated by porous middle walls 5, and outer walls 6, 7 are also porous. The core body 2 and a connected body 3 are formed of conductive silicon carbide, and a silicon element is further infiltirated into the connected body 3 under a vacuum state at 1600°C. In this case, the silicon covers outer walls 10, 11, 12, 13 in the shape of a plate piece. The abutting faces of the core body 2 and of a connected body 3 are provided with a mixed paste of a silicon and a carbon powder, and next a molded body 1 having the connected body 3 abutted on the core body 2 is reactantly burned. The connected body 3 and each silicon carbide material join during a reactive combustion to form a strong conductive coupling.


Inventors:
Walter best
Oliver Bent House
Wolfgang Schaefer
Uwe Schumacher
Application Number:
JP6099999A
Publication Date:
March 26, 2001
Filing Date:
March 09, 1999
Export Citation:
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Assignee:
Thomas Joseph Heimbach Gesellschaft Mitt Beschlenktel Haftung Und Company
International Classes:
B01D39/20; B01D46/00; B01D46/24; B01D46/42; B01D53/86; B01D71/02; B01J35/02; B01J35/04; C04B38/00; C04B41/51; C04B41/88; F01N3/02; F01N3/022; F01N3/027; F01N3/20; F01N3/28; (IPC1-7): F01N3/02; B01D39/20; B01D46/42; B01J35/02; C04B41/88
Domestic Patent References:
JP6173645A
JP1244110A
JP6173649A
JP7102944A
JP711934A
JP742532A
JP750571B2
Attorney, Agent or Firm:
Eisuke Kishimoto (3 others)