Title:
MOLDING COMPONENT
Document Type and Number:
Japanese Patent JP2023175140
Kind Code:
A
Abstract:
To suppress flooding to through-holes since the through-holes are formed only in a non-flooding area, thereby to further suppress flooding to inner components through the through-holes.SOLUTION: A molding component 1 comprises: inner components 10, 20 including electronic component bodies (detection element bodies 11, 21), and lead wires 12, 13, 22, 23 extended from the electronic component bodies (detection element bodies 11, 21); connection terminals 30 connected to the lead wires 11, 13, 22, 23; a first molding part 40 for covering the inner components 10, 20 and holding the connection terminals 30; and a second molding part 50 for covering the first molding part 40. The second molding part 50 has a non-flooding area X arranged in an area where flooding is suppressed. Through-holes (outer through-holes 51a) arranged from a front surface of the second molding part 50 to the first molding part 40 are formed only in the non-flooding area X of the second molding part 50.SELECTED DRAWING: Figure 5
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Inventors:
WEI LIN
KOYANO HIROYUKI
TERASAKA MOTOJU
KOBAYASHI TOSHINARI
YAMAO MOE
KOYANO HIROYUKI
TERASAKA MOTOJU
KOBAYASHI TOSHINARI
YAMAO MOE
Application Number:
JP2022087441A
Publication Date:
December 12, 2023
Filing Date:
May 30, 2022
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS
International Classes:
G01P1/02
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Akio Takeshita
Tomohiro Fukuichi
Takahiro Arita
Akio Takeshita
Tomohiro Fukuichi