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Title:
MOLDING COMPOUND AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2007169649
Kind Code:
A
Abstract:

To provide a molding compound having excellent oil-swelling property and a method for producing the compound.

The molding compound contains 30-80 wt.% polyamide as a thermoplastic substrate and a crosslinked dispersed elastomer phase. The crosslinked dispersed elastomer phase is bonded to the thermoplastic substrate, the molding compound contains 10-69 wt.% ethylene copolymer and 1-10 wt.% compatibilizing agent based on the compound, and the compatibilizing agent is selected from compounds obtained by grafting an α,β-ethylenic unsaturated mono- and/or dicarboxylic acid or their derivative to a polymer main chain of the ethylene copolymer.


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Inventors:
HOFFMANN BOTHO
STOEPPELMANN GEORG
KERTESZ JANOS
FRITZ HANS-GERHARD
JIN FAN
Application Number:
JP2006345112A
Publication Date:
July 05, 2007
Filing Date:
December 22, 2006
Export Citation:
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Assignee:
EMS CHEMIE AG
RASMUSSEN GMBH
International Classes:
C08L77/00; B29C48/535; B29C48/54; B29C48/56; B29C48/57; C08J3/24; C08L23/08; C08L23/26
Domestic Patent References:
JP2004277740A2004-10-07
JP2004277740A2004-10-07
JPS59135251A1984-08-03
JPS62169852A1987-07-27
JPH04227958A1992-08-18
Attorney, Agent or Firm:
Patent Business Corporation Minori Patent Office



 
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