Title:
MOLDING DEVICE
Document Type and Number:
Japanese Patent JP2016190247
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a molding device which can be downsized.SOLUTION: A molding device 10 for molding a metallic pipe in such a manner that a metallic pipe material 14 is thermally expanded between an upper die 12 and a lower die 11 which pair each other comprises: upper electrodes 17 and 18 and lower electrodes 17 and 18 which sandwich both ends of the metallic pipe material 14 from above and below and which heat the metallic pipe material 14; and a busbar 52 which is connected to the lower electrodes 17 and 18 and supplies electric power from an electric power source 51. The busbar 52 connected to the upper electrodes 17 and 18 is eliminated, and a region occupied by the whole busbar is decreased thereby achieving downsizing of the molding device 10.SELECTED DRAWING: Figure 1
Inventors:
SAIGA MASAYUKI
ISHIZUKA MASAYUKI
UENO KIJO
ISHIZUKA MASAYUKI
UENO KIJO
Application Number:
JP2015070845A
Publication Date:
November 10, 2016
Filing Date:
March 31, 2015
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES
International Classes:
B21D26/047; B21D26/033; B21D37/16
Domestic Patent References:
| JP2012000654A | 2012-01-05 | |||
| JPS5153476Y2 | 1976-12-21 | |||
| JPH0734919Y2 | 1995-08-09 |
Foreign References:
| US20070101786A1 | 2007-05-10 | |||
| WO2014061473A1 | 2014-04-24 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Yasuki Yanagi
Yoshiki Kuroki
Yasuki Yanagi