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Title:
MOLDING AND PACKAGE FOR PHOTOSENSITIVE MATERIAL
Document Type and Number:
Japanese Patent JP3473599
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To enhance the performances of a molding and a package for a photosensitive material using paper-resin, to diminish factors having adverse effects particularly on photographic properties, and to provide a molding and a package for a photosensitive material whose mechanical performance is comparable to that of a molding of 100% thermoplastic resin.
SOLUTION: Waterproof paper for photographic printing paper obtained by coating base paper made for photographic printing paper with a polyolefin resin is cut into pieces to prepare a mixture of cellulose fibers and the polyolefin resin, another thermoplastic resin is added to the mixture if necessary and the objective molding for a photosensitive material containing the base paper and the polyolefin resin molded in such a way that the weight ratio of the polyolefin resin and the another thermoplastic resin to the cellulose fibers originating from the base paper ranges from (51:49) to (75:25) is obtained.


Inventors:
Yoshiaki Miyake
Kazunori Mizuno
Application Number:
JP2001329218A
Publication Date:
December 08, 2003
Filing Date:
October 26, 2001
Export Citation:
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Assignee:
Fuji Photo Film Co., Ltd.
International Classes:
B29B9/06; B29C45/00; B32B23/06; B32B29/02; B65D65/38; B65D81/30; G03C3/00; B29K1/00; B29K23/00; B29K105/12; B29K501/12; (IPC1-7): G03C3/00; B29B9/06; B65D65/38; B65D81/30
Domestic Patent References:
JP7225453A
JP2000194093A
JP954391A
JP2000239528A
JP9150407A
JP834476A
JP200056434A
JP6069649A
JP6118552A
JP2207241A
JP480743A
Attorney, Agent or Firm:
Yasuhiro Noguchi