Title:
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP3473601
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a printed circuit board that can prevent reliability in interlayer connection from deteriorating, and to provide a method for manufacturing the printed circuit board.
SOLUTION: As shown in (a), an insulating base 23 is suitably laminated for performing heating press from both surfaces, where the insulating base 23 has a copper pattern 22 in which a conductive paste 50 containing a tin particle 61 and a silver particle 62 is filled in a via hole 24, thus achieving a conductive composition 51 by melting the tin particle 61 for alloying with the silver particle 62 and at the same time by sintering in one piece. Additionally, a tin constituent in the conductive composition 51 and the copper pattern 22 are subjected to solid phase diffusion mutually for forming a solid phase diffusion layer 52, and the layers of a plurality of conductor patterns 22 (the lower conductor pattern is not illustrated) are electrically connected by highly reliable junction that does not depend on contact conduction.
Inventors:
矢▲崎▼ 芳太郎
Yoshihiko Shiraishi
Koji Kondo
Toshikazu Harada
Tomohiro Yokochi
Yoshihiko Shiraishi
Koji Kondo
Toshikazu Harada
Tomohiro Yokochi
Application Number:
JP2001338119A
Publication Date:
December 08, 2003
Filing Date:
November 02, 2001
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H05K1/09; H05K1/11; H05K3/40; H05K3/46; (IPC1-7): H05K3/46; H05K1/09; H05K1/11; H05K3/40
Domestic Patent References:
| JP200049460A | ||||
| JP2000138457A |
Attorney, Agent or Firm:
Hirohiko Usui (2 outside)
Previous Patent: MOLDING AND PACKAGE FOR PHOTOSENSITIVE MATERIAL
Next Patent: ROTARY SENSOR AND METAL MOLD FOR MANUFACTURING THE SAME
Next Patent: ROTARY SENSOR AND METAL MOLD FOR MANUFACTURING THE SAME