Title:
MOLDING AND SEPARATING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3436983
Kind Code:
B2
Abstract:
PURPOSE: To provide a molding such as an electronic equipment housing made of a metal part and a resin part which can be recycled.
CONSTITUTION: A molding is formed by molding a resin part 1 and a metal part 3 via an adhesive 2 containing thermoplastic resin. A method for separating the molding comprises the step of heating the molding at the thermal deformation temperature or higher of the resin contained in the adhesive 2.
Inventors:
Koichi Kimura
Kota Nishii
Kenshin Ishizuka
Kota Nishii
Kenshin Ishizuka
Application Number:
JP20997994A
Publication Date:
August 18, 2003
Filing Date:
September 02, 1994
Export Citation:
Assignee:
富士通株式会社
International Classes:
B09B3/00; B29B17/02; B29C45/14; B29K105/22; (IPC1-7): B29B17/02; B09B3/00; B29C45/14
Domestic Patent References:
| JP6182808A | ||||
| JP5456680A | ||||
| JP2202406A | ||||
| JP5131449A | ||||
| JP6166769A | ||||
| JP5436190B2 |
Attorney, Agent or Firm:
Shintaro Nogawa
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