PURPOSE: To make a circuit board high in density without bending the leading- out part of an electronic part by a method wherein an adhesive agent which never deteriorates a circuit board in solderability is applied on a part of the circuit board where the electronic component is mounted, the leading-out part of the electronic component is inserted into a mounting hole, the adhesive agent is cured by heating the circuit board mounted with the electronic component, and the leading-out part of the electronic component is soldered to an electrode land.
CONSTITUTION: An adhesive agent 3 which never deteriorates a circuit board 2 in solderability is applied through an automatic dispenser or the like on a part of the circuit board 2 where an electronic component 5 is mounted, a leading-out part 6 of the electronic component 5 is inserted into a mounting hole 1 of the circuit board 2 to mount the electronic component 5 on the circuit board 2. The adhesive agent 3 is cured by heating making the circuit board 2 mounted with the electronic component 5 travel through a heating over or the like. Lastly, the surface of the circuit board 2 is dipped into a solder tank to solder the leading-out part 6 of the electronic part 5 to an electrode land 4 of the circuit board 2.
YAMA IKUO
YAMADA TAKUYA
| JPH01236636A | 1989-09-21 | |||
| JPS6489399A | 1989-04-03 |