Title:
実装装置、実装システム及び検査実装方法
Document Type and Number:
Japanese Patent JP7197705
Kind Code:
B2
Abstract:
A mounting device of the present disclosure used in a mounting system, includes a supply section configured to hold a component, a mounting section configured to pick up the component from the supply section and perform a mounting process for the component on a mounting target, an inspection/imaging section configured to capture an image of the mounting target, and a control section configured to execute a missing component inspection process of detecting whether a component on the mounting target is missing or not by using a captured image of the mounting target, and, when a component is missing, control the mounting section to pick up the missing component from the supply section and dispose the missing component on the mounting target.
Inventors:
Mitsutaka Inagaki
Shigeru Oyama
Haruna Narita
Shigeru Oyama
Haruna Narita
Application Number:
JP2021534864A
Publication Date:
December 27, 2022
Filing Date:
July 19, 2019
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/08
Domestic Patent References:
| JP2007214212A | ||||
| JP2007158052A | ||||
| JP200013097A |
Foreign References:
| WO2017141377A1 | ||||
| WO2015040667A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation ITEC International Patent Office
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