Title:
MOUNTING METHOD AND MOUNTING DEVICE OF CHIP
Document Type and Number:
Japanese Patent JP2006086347
Kind Code:
A
Abstract:
To provide a mounting method in which a warping caused in a board can be removed for mounting chips.
This mounting method for mounting chips to the board comprises the steps of transferring the board for positioning it to a mounting position, supporting one face of the board positioned to the mounting position by a mounting stage 6, mounting a chip 14 by a mounting tool 27 on the other face of the board with the one face being supported by the mounting stage, and pressurizing the board by the mounting tool for chucking it to the mounting stage before the chips are mounted to the board by the mounting tool.
Inventors:
KAWABE KATSUYOSHI
Application Number:
JP2004269778A
Publication Date:
March 30, 2006
Filing Date:
September 16, 2004
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP
International Classes:
H01L21/60; H01L21/52
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Sadao Muramatsu
Ryo Hashimoto
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