Title:
MOUNTING SEMICONDUCTOR PART, MOUNTING STRUCTURE AND METHOD
Document Type and Number:
Japanese Patent JP3846611
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a mounting semiconductor part, a mounting structure, and a mounting method, wherein the semiconductor part is enhanced in connection strength to a wiring board, and the wirings that are laid between terminals are given enough margins for their pitch and width taking a tendency toward high-density mounting and an increase in number of pins into consideration.
SOLUTION: A mounting semiconductor part has a structure where an area terminal 7 is composed of area terminals 7a arranged on the outer edge of a base 6 and area terminals 7b or 7c arranged inside the terminals 7a of the base 6, where the area terminals 7a arranged on the outer edge are set larger in pitch and/or diameter than the area terminals 7b or 7c. Land terminals 13 are arranged on a wiring board 12 in the same arrangement way with area terminals 11 on a semiconductor part, and the area terminals 11 are connected together through the intermediary of conductive adhesive agent 14.
Inventors:
Kazuo Nishiyama
Application Number:
JP27174098A
Publication Date:
November 15, 2006
Filing Date:
September 25, 1998
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L23/12; H01L21/60; H01L23/48; H01L23/498; H05K3/34; H05K1/11; (IPC1-7): H01L23/12
Domestic Patent References:
| JP7221132A | ||||
| JP7307404A | ||||
| JP8097322A | ||||
| JP11274711A |
Attorney, Agent or Firm:
Hiroshi Osaka
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