Title:
MOUNT STRUCTURE FOR CHIP COMPONENT
Document Type and Number:
Japanese Patent JP2022139926
Kind Code:
A
Abstract:
To provide a mount structure of a chip component with high heat-shock resistance.SOLUTION: In a mount structure for a chip resistor 1, a separation distance L1 between a pair of back electrodes 3 formed on an insulating substrate 2 of the chip resistor 20 is set to be shorter than a separation distance L2 between a pair of lands 31 provided in a circuit board 30. On the back electrode 3, a thick part (first electrode part 3a) is formed, and with the top part of this thick part placed right above the inner end of the land 31, an external electrode 9 attached to the back electrode 3 is connected onto the corresponding land 31 through a solder 32.SELECTED DRAWING: Figure 2
Inventors:
AKAHA YASUSHI
Application Number:
JP2021040509A
Publication Date:
September 26, 2022
Filing Date:
March 12, 2021
Export Citation:
Assignee:
KOA CORP
International Classes:
H01C1/148; H01C7/00
Attorney, Agent or Firm:
Patent Attorney Corporation Takewa International Patent Office