Title:
SEMICONDUCTOR MANUFACTURING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2022139927
Kind Code:
A
Abstract:
To provide a semiconductor manufacturing device capable of suppressing a crack or chipping of a semiconductor wafer during cutting of an edge part of the semiconductor wafer, and a method for manufacturing a semiconductor device.SOLUTION: A semiconductor manufacturing device according to an embodiment comprises a stage which can mount a wafer on a mounting surface. A blade cuts an outer periphery of the wafer toward the mounting surface. A stage comprises a protrusion provided in a position corresponding to a first region in which a material film is not formed on a first surface facing the mounting surface in the outer periphery of the wafer.SELECTED DRAWING: Figure 4
Inventors:
SETSUDA YUJI
Application Number:
JP2021040511A
Publication Date:
September 26, 2022
Filing Date:
March 12, 2021
Export Citation:
Assignee:
KIOXIA CORP
International Classes:
H01L21/304; B24B27/06
Attorney, Agent or Firm:
Nakamura Yukitaka
Miyajima Manabu
Takeshi Sekine
Akira Akaoka
Miyajima Manabu
Takeshi Sekine
Akira Akaoka