To enable a front fillet to be properly formed in a mounting structure which is formed by soldering the outer leads of a molded package to lands located on a base.
The outer leads 13 of the molded package 10 are extended from their roots located at the molded package 10 toward the lands 21 and bent at their midway points along the lands 21, and the parts of the outer leads 13 located closer to their tips than the bent parts 14 are made to serve as connections 15 which are joined by soldering. At this point, a solder 30 is configured so as to be composed of a first solder 31 which is located closer to the tip of the outer lead 13 at the connection 15, and a second solder 32 which is located closer to the bent part 14 of the outer lead 13 at the connection 15.
COPYRIGHT: (C)2008,JPO&INPIT
HARADA YOSHIHARU
Takahiro Miura
Fumihiro Mizuno