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Patent Searching and Data


Title:
MOUNTING STRUCTURE OF RESIN MOLD-TYPE HIGH-FREQUENCY TRANSISTOR
Document Type and Number:
Japanese Patent JPS57155754
Kind Code:
A
Abstract:

PURPOSE: To effectively achieve shield and to improve gain attenuation amount at the time of mounting a tuner by a method wherein a pellet is fixed to the inside terminal of a source lead and the lower part and the upper part of the pellet are covered by a ground line and the source lead having the equivalent potential to the ground.

CONSTITUTION: In a resin mold type FET3, a pellet 8 is mounted on a wiring substrate 1 so that the pellet 8 may locate at the lower surface of a source lead 9. A resin package 4 is mounted on the ground line 2 of the wiring substrate 1 and the external terminals of two gate leads 11, a drain lead 12, and a source lead 9 are bent downwards. Furthermore the external terminals are reversely bent for horizontality to superimpose the tips on each wiring layer and leads 5 are fixed to a wiring layer 6. In this way, gain attenuation amount at the time of mounting a tuner is improved.


Inventors:
HOTSUTA KIYOMICHI
MASUDA AKIRA
Application Number:
JP4033781A
Publication Date:
September 25, 1982
Filing Date:
March 23, 1981
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H05K1/18; H01L23/32; H01L23/66; H05K1/02; (IPC1-7): H01L23/32; H05K1/18