Title:
多層配線基板、部品実装方法、及び、撮像装置
Document Type and Number:
Japanese Patent JP4303610
Kind Code:
B2
Abstract:
A multilayer wiring board on which multiple components are overlappingly mounted. The multilayer wiring board includes: a first surface on which a first component among the multiple components is mounted; and a second surface whose height in a thickness direction of the multilayer wiring board is smaller than that of the first surface, by which a step is provided between the first surface and the second surface, a second component among the multiple components being mounted on the second surface to partially overlap the first component in a non-contact manner, the second surface also having a light-transmitting window through which light is transmitted.
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Inventors:
Miyashita Mamoru
Hiroki Ota
Hiroki Ota
Application Number:
JP2004022439A
Publication Date:
July 29, 2009
Filing Date:
January 30, 2004
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03B17/02; H04N5/225; H04N5/335; H04N5/357; H05K1/18; H05K3/46
Domestic Patent References:
| JP2001119006A | ||||
| JP11191864A | ||||
| JP11069241A | ||||
| JP2001078064A | ||||
| JP2001203913A | ||||
| JP9284617A | ||||
| JP2000269472A | ||||
| JP9321439A | ||||
| JP6048216U | ||||
| JP2002223378A | ||||
| JP61010374A | ||||
| JP9163193A | ||||
| JP2002330319A | ||||
| JP11146284A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda