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Patent Searching and Data


Title:
MULTILAYER BOARD
Document Type and Number:
Japanese Patent JPH01220890
Kind Code:
A
Abstract:

PURPOSE: To conduct positive connection without damaging a conductor pattern in another pattern layer, and to improve reliability by forming a pattern layer with a pattern terminal for spot welding and another pattern layer, to which the conductor pattern is shaped, avoiding superposition to the pattern terminal for spot welding.

CONSTITUTION: A board material 1 has a conductor pattern 3, including pattern terminals 2a, 2b for spot welding, shaped in a copper material layer onto the and other conductor patterns 4 on the surface, avoiding superposition to the pattern terminals 2a, 2b on the rear. A thin type battery 5 is arranged at a specified relative position to a multilayer board 10 in order to mount the thin type battery 5 on the multilayer board 10, battery electrodes 6a, 6b are oppositely contacted respectively with the pattern terminals 2a, 2b, and laser beams 7 are applied from the battery electrode 6a, 6b sides. The wiring patterns 4 as other pattern layers are shaped, averting superposition to the pattern terminals 2a, 2b at that time, thus preventing damage, cutting, etc., of the wiring pattern 4, etc.


Inventors:
NAKAMURA KOICHIRO
Application Number:
JP4664388A
Publication Date:
September 04, 1989
Filing Date:
February 29, 1988
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
B23K26/21; H05K1/02; H05K3/32; H05K3/46; H05K1/11; (IPC1-7): B23K26/00; B42D15/02; H05K1/02; H05K3/32; H05K3/46
Attorney, Agent or Firm:
Yasuo Miyoshi (1 outside)