Title:
積層セラミック電子部品
Document Type and Number:
Japanese Patent JP7358760
Kind Code:
B2
Abstract:
To provide a multilayer ceramic electronic component such as a multilayer ceramic capacitor, the multilayer ceramic electronic component having sufficient strength while being capable of attaining low height.SOLUTION: The present invention relates to multilayer ceramic electronic components. This electronic component has a pair of element bodies 4, 4. For each of the element bodies 4, 4, terminal electrodes 6, 8 having tip-side electrode parts 6a, 8a to cover lead-out ends of the element body from which internal electrode layers are led out, and main surface electrode parts 6b, 8b to partially cover an outer main surface vertical to a lamination direction of the element body continuously from the tip-side electrode parts, meanwhile. the terminal electrodes 6, 8 substantially do not exist on an inner main surface of the element body positioned on an opposed side of the outer main surface along the lamination direction. The inner main surfaces 4d, 4d of the pair of element bodies 4, 4 are joined together via an adhesion layer (glass) 60.SELECTED DRAWING: Figure 1A
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Inventors:
Toshio Sakurai
Hirofumi Tanaka
Hirofumi Tanaka
Application Number:
JP2019060900A
Publication Date:
October 11, 2023
Filing Date:
March 27, 2019
Export Citation:
Assignee:
TDK Corporation
International Classes:
H01G4/30; H01G2/02; H01G4/38
Domestic Patent References:
| JP8306576A | ||||
| JP2010129737A | ||||
| JP2001044069A | ||||
| JP2000306765A | ||||
| JP2000260902A |
Attorney, Agent or Firm:
Maeda Suzuki International Patent Attorneys Corporation