Title:
MULTILAYER INTERCONNECTION STRUCTURE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH05243400
Kind Code:
A
Abstract:
PURPOSE: To form a simple and fine multilayer interconnection structure by reducing a stepped part and without opening a fine through hole in a multilayer interconnection structure.
CONSTITUTION: The title structure is provided with the following: a semiconductor substrate 1; a first-layer metal interconnection 14 formed on a diffusion layer 2 in the semiconductor substrate 1; sidewall layers 11A, 11B, for stepped- part reduction use, which are formed on the first-layer metal interconnection 4 as well as a sidewall layer 11C to be used as a through hole pillar; and a second-layer interconnection 14 formed so as to come into contact with the tip part of the through hole pillar 11C protruding on an interlayer insulating film 12A.
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Inventors:
USHIGOE TAKATOSHI
Application Number:
JP4466092A
Publication Date:
September 21, 1993
Filing Date:
March 02, 1992
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L21/3205; H01L21/768; H01L23/522; (IPC1-7): H01L21/90; H01L21/3205
Attorney, Agent or Firm:
Toshiaki Suzuki