Title:
MULTILAYER PRINTED CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0730254
Kind Code:
A
Abstract:
PURPOSE: To provide a multilayer printed circuit board and a semiconductor device in which there are no defects such as warp due to heat, etc., during manufacture and use, and which permit high density wiring and high density mounting.
CONSTITUTION: The multilayer printed circuit board 20 is made of several interconnection wiring layers 2, 10, 12, 14, 16, and 18 respectively on both surfaces. The semiconductor device is formed by mounting semiconductor chips on both sides of the multilayer printed circuit board 20.
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Inventors:
MOCHIZUKI TETSUO
MIZUNO ATSUSHI
MIZUNO ATSUSHI
Application Number:
JP19537593A
Publication Date:
January 31, 1995
Filing Date:
July 13, 1993
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
H01L23/12; H05K3/46; (IPC1-7): H05K3/46; H01L23/12
Attorney, Agent or Firm:
Ichinose Miyao