To solve the problem raised by a multilayered wiring board using an organic material for its insulating layers that a capacitance element having a large capacitance is not able to be formed in the board and, accordingly, the size of an electronic parts module using the board is not able to be reduced.

The multilayered wiring board 4 is constituted by laminating insulating layers 1a-1e made of the organic material upon another, and, at the same time, forming wiring conductors 2 on the surfaces of the insulating layers 1a-1e. In the wiring board 4, the capacitance element A is formed in such a way that a through hole 7 is made through at least one of the insulating layers 1a-1e and dielectric ceramic 8 having a specific inductive capacity of ≥20 is buried in the hole 7. Then the ceramic 8 is sandwiched between wiring conductor layers 2a which are respectively adhered to both the upper and lower surfaces of the ceramic 8 to face each other through conductive organic resin layers 9. Consequently, the capacitance of the element A can be increased and, accordingly, the areas of the opposed electrodes of the element A can be reduced. Therefore, the size of the electronic parts module 5 can be reduced.