Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MULTIPLE CHIP ELECTRONIC COMPONENT AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH09186001
Kind Code:
A
Abstract:

To facilitate multilayer promotion and dividing of a board so as to prevent the occurrence of break, etc., of an electrode, by forming a plurality of electrodes inside the recess of a board consisting of a synthetic resin film, and connecting a plurality of electronic elements on the surfaces of these electrodes.

On both sides of the board 12 consisting of a synthetic resin film such as heat-resistant resin such as PPS, PBT, etc., a plurality of recesses 14 made by dividing through holes are counterposed to each other, and in these recesses 14, the electrodes 16 consisting of a plurality of metallic films are made in a U shape in a cross section by vacuum deposition or sputtering. Then, conductive paste is printed to form an electrode 18, and resistors 20 as a plurality of electronic elements are printed astride the electrodes 18. Overcoats 22 are made on the surface and rear of those resistors 20. Hereby, multilayer promotion can be made easily, and the dividing of the board is also easy, and the occurrence of break, etc., of the electrode 16 can also be prevented.


Inventors:
AZUMA KOUJI
NAGARE ICHIRO
ISHIYAMA ICHIRO
KUROKAWA HIROYUKI
Application Number:
JP35368395A
Publication Date:
July 15, 1997
Filing Date:
December 29, 1995
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HOKURIKU ELECT IND
International Classes:
H01C13/02; H01C7/00; (IPC1-7): H01C7/00; H01C13/02
Attorney, Agent or Firm:
Hirosawa Isao



 
Previous Patent: LIQUID CRYSTAL DISPLAY

Next Patent: SLIDE ELECTRONIC COMPONENT