To provide a multiple component mounting mother board capable of improving the mountability of chip components by improving the flatness of principal surfaces.

The multiple component mounting substrate 10 includes a plurality of laminated dielectric layers, and is partitioned into a plurality of substrate regions 4 having a conductor pattern 2 and a frame-shaped waste region 5 surrounding those substrate regions 4. The dielectric pattern 3 is made of a dielectric material with the same quality as that of the dielectric layer. The multiple component mounting substrate 10 is formed such that an indicator pattern 2 and a dielectric pattern 3 exhibiting different color tone from that of the indicator pattern 2 are deposited and formed on the principal surface of the waste region 4. The indicator pattern 2 is made of a conductive material with the same quality as that of the conductor pattern, and the dielectric pattern 3 is made of a dielectric material of the same quality as that of the dielectric layer.