To further improve component packaging density without losing reliability in a wiring board for incorporating components and to provide its manufacturing method.
First, a core-wiring board having a conductive layer at least on both upper and lower surfaces is manufactured, a through hole in which the cross section appearance consists of a plurality of arcs is formed on the core-wiring board that is manufactured so that space for positioning electric/electronic components to be incorporated is generated, the conductive layer is formed so that the inner surface of the formed through hole is included; the conductive layer on the upper and lower surfaces is subjected to patterning, the conductive layer formed at the through hole is divided according to the number of terminals of the electric/electronic components to be incorporated, the electric/electronic components are positioned in the space, the terminal of the positioned electric/electronic components and the divided conductive layer are connected by a conductive member, and then an insulating layer is laminated and formed overlapping on both the upper and lower surfaces of the core-wiring board, where the electric/electronic components are connected by the conductive wiring, so that the periphery of the electric/electronic components is filled.
IMAMURA TATSURO
SASAOKA KENJI
DT CIRCUIT TECHNOLOGY CO LTD
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