To provide a multiple-pattern wiring board which allows easy and effective attachment of the plating layer of a different thickness and type to interconnection conductors in wiring board regions.

In the multiple-pattern wiring board 1, the plurality of wiring board regions 2 are arranged lengthwise and crosswise on an insulation substrate, and patterns 4 and 5 for conduction of plating for attaching the plating layer to the wiring conductors 6a-6c formed in the wiring board regions 2 by electrolytic plating method are also formed on the insulation substrate. The wiring conductors 6a-6c include first wiring conductors 6a and 6b and second wiring conductors 6c. The patterns 4 and 5 for conduction of plating include first patterns 4 for conduction of plating which are connected to all the first wiring conductors 6a and 6b formed in each wiring board region 2, and n pieces of second patterns 5 (n is an integer of 2 or above) for conduction of plating which are connected to all the second wiring conductors 6c in each group of wiring board regions 2 divided into n groups.